Third generation

Integrated circuits (silicon chips containing multiple transistors). 1964. A pioneering example is the ACPX module used in the IBM 360/91, which, by stacking layers of silicon over a ceramic substrate, accommodated over 20 transistors per chip; the chips could be packed together onto a circuit board to achieve unheard-of logic densities. The IBM 360/91 was a hybrid second- and third-generation computer.